METHOD FOR MANUFACTURING TAPE CSP HAVING ITS SOLDER PAD HOLE PREVIOUSLY FILLED WITH SOLDER

摘要

PROBLEM TO BE SOLVED: To form a soldering ball pad section by plating for improving connection reliability when mounting a soldering ball to the soldering ball pad of a tape CSP.;SOLUTION: Plating (plating 5 such as Sn) is made to the soldering ball pad of the tape CSP having a hole for the soldering ball, thus increasing the connection strength with the soldering ball. In this case, the plating has thickness for filling the soldering ball hole and excellent solderability. Also, without using the soldering ball, by soldering paste printing, connection to a printed circuit board can be made in instead of the soldering ball. A process for carrying out plating (the plating 5 such as Sn) for filling the soldering ball hole is performed between the completion of laminate and the start of photo resist coat in a tape CSP manufacturing process, thus reducing costs.;COPYRIGHT: (C)2002,JPO