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Mechanism of Ball Solderability Improved by Fine-Pitch BGA of Tape Carrier with Copper-Filled Via-Hole

机译：用铜填充通孔的胶带载体细间距BGA改善球可焊性的机理

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Akira CHINDA; Akira MATSUURA; Masahiko SAITOH;
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年度 2003
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1. Effective Solder for Improved Thermo-Mechanical Reliability of Solder Joints in a Ball Grid Array (BGA) Soldered on Printed Circuit Board (PCB) [J] . Depiver Joshua A., Mallik Sabuj, Amalu Emeka H. Journal of Electronic Materials . 2021,第1期

机译：用于在印刷电路板（PCB）上焊接的球栅阵列（BGA）中焊点的热机械可靠性的有效焊料
2. The IMC rings growth mechanism in Sn-Ag-Cu solder ball and NiAu-plated BGA ball pad [J] . Chen C.-H. Journal of the Chinese Institute of Engineers . 2013,第4期

机译：IMC环在Sn-Ag-Cu焊料球和镀NiAu的BGA球焊盘中的生长机理
3. Effects of Polyacrylonitrile Anchoring Polymer Layer Solder Anisotropic Conductive Films on the Solder Ball Movement for Fine-Pitch Flex-on-Flex (FOF) Assembly [J] . Yoon Dal-Jin, Lee Sang-Hoon, Paik Kyung-Wook Components, Packaging and Manufacturing Technology, IEEE Transactions on . 2019,第5期

机译：聚丙烯腈固定聚合物层焊料各向异性导电膜对小间距挠性挠性（FOF）组件的焊球运动的影响
4. MECHANICAL SHOCK AND DROP RELIABILITY EVALUATION OF THE BGA SOLDER JOINT STACK-UPS FORMED BY REFLOW SOLDERING SAC SOLDER BALLS BGAs WITH BiSnAg AND RESIN REINFORCED BiSn-BASED SOLDER PASTES [C] . Olivia H. Chen, Al Molina, Raiyo Aspandiar, SMTA international conference . 2015

机译：含BiSnAg和树脂增强的BiSn基焊料的BGA的回流焊接SAC焊料球形成的BGA焊料接头的机械冲击和滴落可靠性评估
5. Modeling of Failure Mechanism and Life Prediction of Lead-Free BGA Solder Joint under Repetitive Mechanical Drop Loading. [D] . Jiang, Tong. 2012

机译：重复机械跌落载荷作用下无铅BGA焊点失效机理的建模和寿命预测。
6. Direct evidence of multichannel-improved charge-carrier mechanism for enhanced photocatalytic H2 evolution [O] . Jiangtao Zhao, Peng Zhang, Zhuo Wang, -1

机译：多通道改进的电荷载流子机制增强光催化氢气释放的直接证据
7. Tape Carrier with Buried Via-Holes of Copper Plating for BGA Package of Good Ball Solderability. [O] . Akira CHINDA, Akira MATSUURA 2002

机译：带载体具有铜电镀镀铜通孔的胶带载体，用于BGA包装的良好球可焊性。

Mechanism of Ball Solderability Improved by Fine-Pitch BGA of Tape Carrier with Copper-Filled Via-Hole

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