Arrangement for soldering terminal pin of THT component in hole of printed circuit board, has heat conducting devices to support heat input to base of circuit board, and solder pad that is mounted on solder preform

摘要

The arrangement (10) has bore solder pads (16,34,47) whose ends are connected to an upper surfaces (17,38,48) of the circuit boards (11,31,41). The heat conducting devices (23,37,45,50) are provided to support a heat input to the bases (18,39,49) of the circuit board. The solder pad is mounted on solder preform (22).