Device for soldering electronic modules equipped with components useful in microelectronics circuit boards or printed circuit boards, comprises a preheating zone, in which the components and the modules are preheated, and a soldering zone

摘要

The device for soldering electronic modules (2) equipped with components useful in microelectronics circuit boards or printed circuit boards, comprises a preheating zone (3), in which the components and the modules are preheated, and a soldering zone (5, 8), in which soldering joints are soldered. A radiation furnace is present in the soldering zone with high-performance radiation sources (6) directed on the modules. A mask (7) shielding the module in the radiation furnace is partially present above the radiation sources. The radiation sources are halogen spotlights. The device for soldering electronic modules (2) equipped with components useful in microelectronics circuit boards or printed circuit boards, comprises a preheating zone (3), in which the components and the modules are preheated, and a soldering zone (5, 8), in which soldering joints are soldered. A radiation furnace is present in the soldering zone with high-performance radiation sources (6) directed on the modules. A mask (7) shielding the module in the radiation furnace is partially present above the radiation sources. The radiation sources are halogen spotlights and are formed by a laser beam. A laser soldering station is provided in the soldering zone. A protective atmosphere is provided. The laser of the laser soldering station and/or the radiation sources of the radiation furnace are arranged in a zone separated outside of the soldering zone by a radiation-permeable covering medium. The radiation of the laser is guided at the soldering joints over mirror optics and/or refracting optics. The laser is movable along the orthogonal axis.