Simplified heat transfer modeling for Vapour Phase Soldering based on filmwise condensation for different horizontal Printed Circuit Boards

摘要

The paper presents a method for investigating heat transfer during a specific reflow soldering method, Vapour Phase Soldering (VPS), where a horizontal Printed Circuit Board (PCB) is heated in vapour medium. The paper presents refined descriptions of filmwise condensation which were investigated and adjusted for the VPS process. The results show a proper and fast approximation of measurements. The dependence of the PCB characteristic length is also investigated.