Heating printed circuit boards to solder components - in closed vessel contg. nozzles producing vapour by directing superheated liq. at PCBs to transfer heat by condensn. of vapour on PCBs

摘要

The method is intended for heating objects by condensation thereon of vapour brought into contact with the objects. This vapour is obtd. by atomising superheated liq. in the vicinity of the objects, pref. by nozzles directed at the objects. The condensate left on the objects is pref. removed therefrom by jets of a (blanking) gas directed at the objects. The process may be carried out in a closed vessel with inlet and outlet for object transport means, supply means for superheated liq., and a bottom drain opening for the condensate.