Studying heat transfer on inclined printed circuit boards during vapour phase soldering

Geczy Attila; Nagy Daniel; Illes Balazs; Fazekas Laszlo; Krammer Oliver; Busek David

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Studying heat transfer on inclined printed circuit boards during vapour phase soldering

机译：在气相焊接期间研究倾斜印刷电路板的传热

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Purpose - The paper aims to present an investigation of heating during vapour phase soldering (VPS) on inclined printed circuit board (PCB) substrates. The PCB is a horizontal rectangular plate from the aspect of filmwise condensation with a given inclination setting.

机译：目的 - 纸张旨在在倾斜印刷电路板（PCB）基板上的气相焊接（VPS）期间进行加热调查。 PCB是来自具有给定倾斜设置的胶片冷凝的方面的水平矩形板。

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来源
《Soldering & Surface Mount Technology》 |2017年第1期|共8页
作者
Geczy Attila; Nagy Daniel; Illes Balazs; Fazekas Laszlo; Krammer Oliver; Busek David;
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作者单位

Budapest Univ Technol &

Econ Dept Elect Technol Budapest Hungary;

Budapest Univ Technol &

Econ Dept Elect Technol Budapest Hungary;

Budapest Univ Technol &

Econ Dept Elect Technol Budapest Hungary;

Budapest Univ Technol &

Econ Dept Elect Technol Budapest Hungary;

Budapest Univ Technol &

Econ Dept Elect Technol Budapest Hungary;

Czech Tech Univ Dept Electrotechnol Prague Czech Republic;

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原文格式 PDF
正文语种 eng
中图分类焊接一般性问题;
关键词
Reflow soldering; Thermal profiling; Filmwise condensation; Inclination; Vapour phase soldering;

机译：回流焊接;热分析;胶片冷凝;倾斜;气相焊接;

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专利

1. Studying heat transfer on inclined printed circuit boards during vapour phase soldering [J] . Geczy Attila, Nagy Daniel, Illes Balazs, Soldering & Surface Mount Technology . 2017,第1期

机译：在气相焊接期间研究倾斜印刷电路板的传热
2. Investigating heat transfer coefficient differences on printed circuit boards during vapour phase reflow soldering [J] . Attila Geczy International Journal of Heat and Mass Transfer . 2017,第juna期

机译：研究气相回流焊接过程中印刷电路板上的传热系数差异
3. Simplified heat transfer modeling for Vapour Phase Soldering based on filmwise condensation for different horizontal Printed Circuit Boards [J] . Attila Geczy, Balazs Illes, Zsolt Peter, Heat and mass transfer . 2015,第3期

机译：基于薄膜状冷凝的气相焊接的简化热传递模型，适用于不同的水平印刷电路板
4. Analytical Solution of Heat Distribution Inside a Printed Circuit Board During Vapour Phase Soldering [C] . Dániel Straubinger, István Bozsóki, Balázs Illés, 2019 42nd International Spring Seminar on Electronics Technology . 2019

机译：气相焊接过程中印刷电路板内部热量分布的解析解
5. A study of heat transfer in non-boiling two-phase gas-liquid flow in pipes for horizontal, slightly inclined, and vertical orientations [D] . Tang, Clement Chih-Wei 2011

机译：水平，轻微倾斜和垂直方向的管道中非沸腾两相气液流传热的研究
6. A Comprehensive Study on The Accelerated Weathering Properties of Polypropylene—Wood Composites with Non-Metallic Materials of Waste-Printed Circuit Board Powders [O] . Shenghui Tian, Yuanfang Luo, Jizun Chen, 2019

机译：废印制线路板粉末非金属材料聚丙烯—木材复合材料加速风化性能的综合研究
7. Release of Solder on Printed Circuit Boards by Heating and Vibrating. [O] . Katsuhito NAKAZAWA, Hironobu SAKATA, Hiroyasu SAKAMURA, 1998

机译：通过加热和振动释放印刷电路板上的焊料。

Studying heat transfer on inclined printed circuit boards during vapour phase soldering

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