The advance of micro engineering technology in the last two decades has been truly impressive in both its pace and the diversity of new applications. In a broad sense, a microsystem consists of microelectromechanical systems (MEMS), signal transduction and processing units, and the electromechanical package. The worldwide market for microsystems, including MEMS and sensors, in the year 2000 was projected to be a staggering $110 billion. Many MEMS and microsystems involve structural components in the form of delicate thin beams and diaphragms. Excessive stresses and deformation of these components induced by the operating loads can seriously affect the performance of these devices.
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