Protect Your High-Speed Circuits From ESD Transients

摘要

Electrostatic discharge (ESD) frequently occurs in nature, and in the electronics equipment environment, with very damaging results. Indeed, it's responsible for more than 25% of the semiconductor chip damage happening during wafer fab, through various stages of circuit assembly, and on the completed and in-use electronics equipment. Typically, the discharge stems from a human body part (finger) being in close proximity to electrically charged dissimilar materials, and then subsequently to conductive contact points attached to electronic devices. At best, this causes damaged ICs and warranty claims against the manufacturers of the end-user devices.