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Recombination lifetime of short-base-width devices using the pulsed MOS capacitor technique

机译:使用脉冲MOS电容器技术的短基宽器件的复合寿命

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The authors point out that the technique of D.K. Schroder, J.D. Whitfield, and C.J. Varker (see ibid., vol.ED-31, no.4, p.462, 1984) for the determination of recombination lifetime using pulsed MOS capacitors at elevated temperatures does not consider lateral quasi-neutral bulk generation and the time dependence of the width of the space-charge region in short-base-width devices (i.e. epitaxial wafers). Consequently, calculations using this technique indicate that the recombination lifetime is a function of device diameter. A simple one-dimensional approach is proposed in which bulk generation in the lateral area of the device is taken into consideration resulting in a fairly uniform recombination lifetime that is independent of the device diameter for short-base-width devices.
机译:作者指出D.K. Schroder,JD Whitfield和CJ Varker(同上,ED-31,第4卷,第462页,1984年),用于确定在高温下使用脉冲MOS电容器的复合寿命时,未考虑横向准中性体积短基宽器件(即外延晶片)中空间电荷区宽度的产生和时间依赖性。因此,使用该技术的计算表明复合寿命是器件直径的函数。提出了一种简单的一维方法,其中考虑了在器件的横向区域中的大量产生,从而导致相当均匀的复合寿命,而该寿命与短基宽器件的器件直径无关。

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