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The effects of boron penetration on p/sup +/ polysilicon gated PMOS devices

机译:硼渗透对p / sup + /多晶硅门控PMOS器件的影响

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The penetration of boron into and through the gate oxides of PMOS devices which employ p/sup +/ doped polysilicon gates is studied. Boron penetration results in large positive shifts in V/sub FB/, increased PMOS subthreshold slope and electron trapping rate, and decreased low-field mobility and interface trap density. Fluorine-related effects caused by BF/sub 2/ implantations into the polysilicon gate are shown to result in PMOS threshold voltage instabilities. Inclusion of a phosphorus co-implant or TiSi/sub 2/ salicide prior to gate implantation is shown to minimize this effect. The boron penetration phenomenon is modeled by a very shallow, fully-depleted p-type layer in the silicon substrate close to the SiO/sub 2//Si interface.
机译:研究了硼在采用p / sup + /掺杂多晶硅栅极的PMOS器件的栅极氧化物中的渗透和渗透。硼的渗透会导致V / sub FB /发生大的正向偏移,增加的PMOS亚阈值斜率和电子俘获速率,以及降低的低场迁移率和界面陷阱密度。由BF / sub 2 /注入多晶硅栅极引起的与氟相关的效应显示为导致PMOS阈值电压不稳定性。已显示在栅极注入之前包含磷共注入物或TiSi / sub 2 /自对准硅化物可以最大程度地降低这种影响。硼渗透现象是通过硅衬底中靠近SiO / sub 2 // Si界面的非常浅的,完全耗尽的p型层模拟的。

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