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Modeling of output snapback characteristics in n-channel SOI MOSFETs

机译:n通道SOI MOSFET中的输出骤回特性建模

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The snapback effect is usually observed in the output characteristics of an n-channel SOI MOSFET with zero gate voltage in which the drain-to-source breakdown voltage is less than the drain-to-body avalanche voltage. It can be attributed to parasitic lateral bipolar actions as well as the MOS feedback mode of operation-a point often overlooked in the literature. An analytical model is developed for predicting the observed output characteristics taking into account both the bipolar and the MOS mechanisms. Results obtained from this model agree well with the experimental I-V curves, and show that, with continuing scaling of device geometries and improvement in SOI materials, the bipolar-induced snapback will become dominant in the future.
机译:通常在具有零栅极电压的n沟道SOI MOSFET的输出特性中观察到骤回效应,其中漏极至源极的击穿电压小于漏极至本体的雪崩电压。它可以归因于寄生的横向双极性作用以及MOS反馈操作模式-这在文献中经常被忽略。考虑到双极和MOS机理,开发了一种分析模型来预测观察到的输出特性。从该模型获得的结果与实验的I-V曲线非常吻合,并且表明,随着器件几何尺寸的不断缩小和SOI材料的改进,双极性感应的回弹将在未来成为主导。

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