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首页> 外文期刊>IEEE Transactions on Electron Devices >The characteristics of the lateral IGBT on the thin SOI film when the collector voltage of the IGBT is applied to the substrate
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The characteristics of the lateral IGBT on the thin SOI film when the collector voltage of the IGBT is applied to the substrate

机译:将IGBT的集电极电压施加到衬底上时,SOI薄膜上的横向IGBT的特性

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摘要

The characteristics of the lateral IGBT on an SOI film when the collector voltage of the IGBT is applied to the substrate are investigated for its application to a high side switch. The measurements of the blocking capability and the dynamic latch-up current during the turn-off transient under an inductive load are carried out with varying thicknesses of the SOI film. A 260 V IGBT can be fabricated on a 5 /spl mu/m thick SOI film without the special device structure. The dynamic latch-up current is improved by reducing the SOI film thickness. This paper shows that applying the collector voltage of the IGBT to the substrate makes it possible to improve the characteristics of the IGBT on a thin SOI film.
机译:研究了将IGBT的集电极电压施加到衬底上时,SOI膜上的横向IGBT的特性,并将其应用于高端开关。在SOI膜厚度不同的情况下,在电感性负载下的关断瞬态过程中,对阻断能力和动态闩锁电流的测量。无需特殊的器件结构,就可以在5 / splμm/ m的SOI膜上制造260 V IGBT。通过减小SOI膜厚度可以改善动态闩锁电流。本文表明,将IGBT的集电极电压施加到基板上可以改善薄SOI膜上IGBT的特性。

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