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A novel technique for profiling the lateral n/sup -/ doping concentrations of submicron LDD MOS devices

机译:用于分析亚微米LDD MOS器件的横向n / sup- /掺杂浓度的新技术

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This paper reports a simple I-V method for the first time to determine the lateral lightly-doped source/drain (S/D) profiles (n/sup -/ region) of LDD n-MOSFETs. One interesting result is the direct observation of the reverse-short-channel effect (RSCE). It is observed that S/D n/sup -/ doping profile is channel length dependent if reverse short-channel effect exists as a result of the interstitial imperfections caused by Oxide Enhanced Diffusion (OED) or S/D implant. Not only the lateral profiles for long-channel devices but also for short-channel devices can be determined. One other practical application of the present method for device drain engineering has been demonstrated with a LATID MOS device drain engineering work. It is convincible that the proposed method is well suited for the characterization and optimization of submicron and deep-submicron MOSFETs in the current ULSI technology.
机译:本文首次报道了一种简单的I-V方法,用于确定LDD n-MOSFET的横向轻掺杂源极/漏极(S / D)轮廓(n / sup-/区域)。一个有趣的结果是直接观察到反向短信道效应(RSCE)。可以观察到,如果由于氧化物增强扩散(OED)或S / D注入引起的间隙缺陷而存在反向短沟道效应,则S / D n / sup-/掺杂分布取决于沟道长度。不仅可以确定长通道设备的横向轮廓,还可以确定短通道设备的横向轮廓。已经通过LATID MOS器件漏极工程工作证明了本方法用于器件漏极工程的另一实际应用。令人信服的是,提出的方法非常适合当前ULSI技术中亚微米和深亚微米MOSFET的表征和优化。

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