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首页> 外文期刊>IEEE Transactions on Electron Devices >Analysis of emitter efficiency enhancement induced by residual stress for in situ phosphorus-doped polysilicon emitter transistors
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Analysis of emitter efficiency enhancement induced by residual stress for in situ phosphorus-doped polysilicon emitter transistors

机译:原位掺杂磷的多晶硅发射极晶体管的残余应力引起的发射极效率提高的分析

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This paper analyzes the enhancement of emitter efficiency in in situ phosphorus-doped polysilicon (IDP) emitter transistors, whose polysilicon emitter is crystallized from an in situ phosphorus-doped amorphous Si film. There are two factors that enhance the emitter efficiency of the IDP emitter. One is a potential barrier at the LDP/substrate interface produced by residual stress in the IDP layer. The other is a very thin oxide layer at the interface, which prevents epitaxial growth at the interface. We have distinguished between the emitter efficiency enhancement due to each of these two factors by analyzing the characteristics of three types of IDP emitter in which the residual stress and the thin oxide layer at the interface are controlled differently. We found that the potential barrier due to the residual stress increases the emitter efficiency from about two times to about eight times depending on the emitter size, and that the thin oxide layer at the interface increases the emitter efficiency by about three times.
机译:本文分析了原位磷掺杂多晶硅(IDP)发射极晶体管的发射极效率提高,该晶体管的多晶硅发射极是从原位磷掺杂非晶硅膜中结晶出来的。有两个因素可以提高IDP发射器的发射器效率。一种是由IDP层中的残余应力在LDP /衬底界面处形成的势垒。另一个是界面处非常薄的氧化物层,这防止了界面处的外延生长。通过分析三种类型的IDP发射极的特性,我们区分了由于这两个因素而导致的发射极效率提高,在该三种IDP发射极中,界面处的残余应力和薄氧化层受到不同的控制。我们发现,由于残余应力而导致的势垒,取决于发射极的尺寸,将发射极的效率从大约两倍提高到大约八倍,并且在界面处的薄氧化物层将发射极的效率提高了大约三倍。

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