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Effects of Ir electrodes on barium strontium titanate thin-film capacitors for high-density memory application

机译:Ir电极对高密度存储应用中钛酸钡锶薄膜电容器的影响

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Excellent electrical characteristics of RF-sputtered Barium Strontium Titanate (BST) thin-film capacitors with iridium (Ir) electrodes were obtained and the influence of Ir on device properties was investigated. In contrast to conventional Pt-electroded system, BST capacitors with Ir electrodes exhibit higher polarization and slightly higher leakage current. The stronger crystallinity of a thin BST layer (/spl sim/70 /spl Aring/) initially grown on Ir substrate is believed to be the cause for higher charge storage density of the Ir-electroded capacitors. However, this higher polarization is accompanied by higher dielectric dispersion (3.12% per decade for Ir versus 1.98% for Pt electrodes). On the other hand, leakage current appears to be dominated by the Schottky barrier formed by Ir-BST and Pt-BST contacts, respectively, at high field. The analysis from temperature-dependent J-V data indicates a lower barrier height for the Ir-BST contact than Pt-BST contact. The slightly higher leakage current density of the BST capacitors with Ir electrodes can thus be attributed to the lower barrier height.
机译:获得了具有铱(Ir)电极的RF溅射钛酸锶钡(BST)薄膜电容器的优良电特性,并研究了Ir对器件性能的影响。与传统的Pt电极系统相比,带有Ir电极的BST电容器具有更高的极化度和略高的泄漏电流。最初在Ir衬底上生长的薄BST层(/ spl sim / 70 / spl Aring /)的较强结晶性被认为是Ir电容器的更高电荷存储密度的原因。然而,这种更高的极化率伴随着更高的介电色散(Ir每十年每百分之3.12%,Pt电极每十年每百分之一1.98%)。另一方面,在高电场下,漏电流似乎主要由Ir-BST和Pt-BST触点形成的肖特基势垒所控制。根据温度相关的J-V数据进行的分析表明,Ir-BST触点的势垒高度比Pt-BST触点的势垒高度低。具有Ir电极的BST电容器的漏电流密度稍高,可以归因于较低的势垒高度。

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