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Hot-carrier-induced degradation for partially depleted SOI 0.25-0.1 /spl mu/m CMOSFET with 2-nm thin gate oxide

机译:具有2nm薄栅氧化层的部分耗尽SOI 0.25-0.1 / splμ/ m CMOSFET的热载流子引起的退化

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摘要

Hot-carrier-induced degradation of partially depleted SOI CMOSFETs was investigated with respect to body-contact (BC-SOI) and floating-body (FB-SOI) for channel lengths ranging from 0.25 down to 0.1 /spl mu/m with 2 nm gate oxide. It is found that the valence-band electron tunneling is the main factor of device degradation for the SOI CMOSFET. In the FB-SOI nMOSFET, both the floating body effect (FBE) and the parasitic bipolar transistor effect (PBT) affect the hot-carrier-induced degradation of device characteristics. Without apparent FBE on pMOSFET, the worst hot-carrier stress condition of the 0.1 /spl mu/m FB-SOI pMOSFET is similar to that of the 0.1 /spl mu/m BC-SOI pMOSFET.
机译:对于体接触(BC-SOI)和浮体(FB-SOI),研究了热耗尽引起的部分耗尽SOI CMOSFET的退化,其沟道长度范围为0.25到0.1 / splμu/ m(2 nm)栅极氧化物。发现价带电子隧穿是SOI CMOSFET器件性能下降的主要因素。在FB-SOI nMOSFET中,浮体效应(FBE)和寄生双极晶体管效应(PBT)都会影响热载流子引起的器件性能下降。在pMOSFET上没有明显的FBE时,0.1 / splμm/ m FB-SOI pMOSFET的最坏的热载流子应力条件类似于0.1 / splμu/ m的BC-SOI pMOSFET。

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