首页> 外文期刊>IEEE Transactions on Electron Devices >Memory characterization of SiGe quantum dot flash memories with HfO/sub 2/ and SiO/sub 2/ tunneling dielectrics
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Memory characterization of SiGe quantum dot flash memories with HfO/sub 2/ and SiO/sub 2/ tunneling dielectrics

机译:具有HfO / sub 2 /和SiO / sub 2 /隧穿电介质的SiGe量子点闪存的存储特性

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In this study, we have developed a SiGe dot floating-gate flash memory with high-K dielectric (HfO/sub 2/) tunneling oxide. Using SiGe dots and HfO/sub 2/ tunneling oxide, a low program/erase voltage can be achieved, along with good endurance and charge retention characteristics as compared to the SiGe dots with a SiO/sub 2/ tunneling oxide. We have also examined the impact of Ge concentration in the SiGe dots on charge retention time. This demonstrates that the SiGe dots with HfO/sub 2/ tunneling oxide can be used as the floating gate to replace SiGe dots with SiO/sub 2/ tunneling oxide and have a high potential for further scaling of floating gate memory devices.
机译:在这项研究中,我们开发了具有高K电介质(HfO / sub 2 /)隧穿氧化物的SiGe点浮栅闪存。与具有SiO / sub 2 /隧穿氧化物的SiGe点相比,使用SiGe点和HfO / sub 2 /隧穿氧化物可以实现低编程/擦除电压,以及良好的耐久性和电荷保持特性。我们还检查了SiGe点中Ge浓度对电荷保持时间的影响。这表明具有HfO / sub 2 /隧穿氧化物的SiGe点可以用作浮栅,以代替具有SiO / sub 2 /隧穿氧化物的SiGe点,并且具有用于进一步缩小浮栅存储器件的潜力。

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