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Monolithic Silicon Smart Tactile Image Sensor With Integrated Strain Sensor Array on Pneumatically Swollen Single-Diaphragm Structure

机译:在气动膨胀的单隔膜结构上集成应变传感器阵列的单片硅智能触觉图像传感器

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摘要

In this paper, a novel concept of silicon-microelectro-mechanical system tactile image sensor aimed at fingertip tactile applications and evaluation results of a prototype device are presented. Array of strain-sensitive sensor pixels is integrated on a pneumatically swollen silicon diaphragm with signal processing circuits in monolithic configuration. Elastic surface of the tactile image sensor is realized using repulsive force of the air pressure applied to diaphragm backside. Contact force distribution of an object is detected from the stress distribution change on the diaphragm using piezoresistor array. Force range and force sensitivity can be controlled by the pressure even after device packaging step. In this principle, fine pitch of pixels and a large-scale sensing array can be easily realized using the abilities of silicon CMOS technology. In addition, the movable stroke of sensor surface can be made much longer than the individually formed micromechanical pixels. A prototype device, of the new concept, with 3040 × 3040 μm{sup}2 sensing diaphragm was fabricated with integrated 6 × 6 array of 420-μm pitch pixels. Increased movable stroke of the swollen diaphragm from the original surface is around 30 μm at 23-kPa pressure at the top. Realized spatial resolution of the prototype device is approximately 400 μm, which is determined by the relationship between the pixel pitch and mechanical crosstalk among the pixels. Positions of touch and their contact force amplitudes were detected as a two-dimensional distribution of the output voltage from the pixel array in a multipoint contact test. The maximum input-force range can be controlled from 21 to 176 mN by changing the backside pressure from 5 to 64 kPa. Through the evaluation of the fabricated device, major advantages of this tactile image sensor have been demonstrated successfully.
机译:在本文中,提出了针对指尖触觉应用的硅微机电系统触觉图像传感器的新概念以及原型设备的评估结果。应变敏感的传感器像素阵列集成在一个气动膨胀的硅膜片上,信号处理电路为单片配置。触觉图像传感器的弹性表面是通过施加到隔膜背面的气压排斥力来实现的。使用压敏电阻阵列,根据隔膜上应力分布的变化来检测物体的接触力分布。即使在器件包装步骤之后,也可以通过压力来控制作用力范围和作用力灵敏度。按照这一原理,利用硅CMOS技术的能力可以轻松实现像素的精细间距和大规模的感应阵列。另外,与单独形成的微机械像素相比,可以使传感器表面的可移动行程更长。新概念的原型设备具有3040×3040μm{sup} 2感测膜片,并集成了420μm间距像素的6×6阵列。在顶部的23kPa压力下,膨胀的隔膜从原始表面增加的可移动冲程约为30μm。原型设备的已实现空间分辨率约为400μm,这取决于像素间距与像素之间的机械串扰之间的关系。在多点接触测试中,将触摸位置及其接触力幅度检测为像素阵列输出电压的二维分布。通过将背面压力从5 kPa更改为64 kPa,可以将最大输入力范围控制在21到176 mN之间。通过评估所制造的设备,已成功证明了该触觉图像传感器的主要优点。

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