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Highly Manufacturable Double-Gate FinFET With Gate-Source/Drain Underlap

机译:具有栅极-源极/漏极重叠的高度可制造的双栅极FinFET

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摘要

The speed performance of a double-gate (DG) FinFET CMOS with gate-source/drain (G-S/D) underlap is investigated using 2-D device and mixed-mode circuit simulation. By optimizing the G-S/D underlap, we demonstrate that the fin thickness of a DG FinFET can be significantly increased up to the physical gate length without degrading the speed performance compared to the conventional G-S/D overlap structure, where the fin thickness needs to be less than one-half of the physical gate length to control short-channel effects. Such an increase in fin thickness combined with a relaxed requirement for abruptness in the source/drain profile can dramatically enhance the manufacturability of DG FinFETs for the 32-nm technology node and beyond.
机译:利用二维器件和混合模式电路仿真研究了具有栅极-源极/漏极(G-S / D)重叠的双栅极(DG)FinFET CMOS的速度性能。通过优化GS / D重叠,我们证明了与传统的GS / D重叠结构相比,DG FinFET的鳍片厚度可以显着增加到物理栅极长度,而不会降低速度性能。小于物理栅极长度的一半以控制短沟道效应。鳍厚度的这种增加,加上对源极/漏极轮廓突然变化的宽松要求,可以显着提高DG FinFET在32纳米技术节点及以后的可制造性。

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