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Part I: On the Behavior of STI-Type DeNMOS Device Under ESD Conditions

机译:第一部分:STI型DeNMOS器件在ESD条件下的行为

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We present experimental and simulation studies of shallow trench isolation (STI)-type drain-extended n-channel metal–oxide–semiconductor devices under human body model (HBM)-like electrostatic discharge (ESD) conditions. Physical insight toward pulse-to-pulse instability is given. Both the current $(I_{rm TLP})$ and time evolution of various events such as junction breakdown, parasitic bipolar triggering, and the base push-out effect are discussed in detail. Differences between the 2-D and 3-D simulation (modeling) approaches are presented, and the importance of 3-D technology-computer-aided-design-based modeling is discussed. Furthermore, a deeper physical insight toward the base push-out is given, which shows significant power dissipation due of space charge build-up, which is found at the onset of self-heating in the 2-D plane.
机译:我们在类似人体模型(HBM)的静电放电(ESD)条件下,对浅沟槽隔离(STI)型漏极扩展n沟道金属氧化物半导体器件进行了实验和仿真研究。给出了对脉冲间不稳定性的物理见解。详细讨论了各种事件的当前$(I_ {rm TLP})$和时间演变,例如结击穿,寄生双极触发和基极推出效应。提出了2-D和3-D仿真(建模)方法之间的差异,并讨论了基于3-D技术-计算机辅助设计的建模的重要性。此外,给出了对基础推出的更深入的物理见解,它显示了由于空间电荷积聚而导致的显着功耗,这是在二维平面中自加热开始时发现的。

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