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A Novel Approach Using Discrete Grain-Boundary Traps to Study the Variability of 3-D Vertical-Gate NAND Flash Memory Cells

机译:一种使用离散晶界陷阱研究3D垂直门NAND闪存单元变异性的新方法

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The 3-D NAND flash memory architectures will be a future trend, because they provide high memory capacity without aggressively scaling down. A vertical-gate (VG) structure composed of polysilicon (poly-Si) channels is a promising 3-D structure that could facilitate realizing an extremely tight-pitch NAND flash memory cell with high memory capacity. However, the variability of the VG memory cell induced by grain boundaries in the poly-Si channels is a major concern for aggressively scaled-down memory cells. In this paper, a discrete-trap approach is applied to emulate the real trap effects in a 3-D memory cell, and the 3-D structure geometry effects and the variation in the threshold voltage ( induced by the discrete grain-boundary traps are studied. Various behaviors related to the structure geometry and trap position are examined. The effect of varying the body thickness on the is stronger than that of varying the channel width. This paper presents various cases for using the discrete-trap approach to study the variability of in 3-D VG memory cells.
机译:3-D NAND闪存架构将成为未来的趋势,因为它们可提供高存储容量而不会大幅缩减规模。由多晶硅(poly-Si)通道组成的垂直栅极(VG)结构是一种很有前途的3-D结构,可以促进实现具有高存储容量的极小间距NAND闪存单元。然而,由多晶硅通道中的晶界引起的VG存储单元的可变性是积极地按比例缩小的存储单元的主要关注点。在本文中,采用离散陷阱方法来模拟3-D存储单元中的实际陷阱效应,并且3-D结构几何效应和阈值电压的变化(由离散的晶界陷阱引起的研究了与结构几何形状和阱位置有关的各种行为,改变体厚对阱的影响大于改变通道宽度的影响,本文介绍了使用离散阱方法研究变异性的各种情况。在3-D VG存储单元中。

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