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Accurate Boundary Condition for Short-Channel Effect Compact Modeling in MOS Devices

机译:MOS器件中短通道效应紧凑建模的精确边界条件

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In this paper, the boundary conditions at the edges of the junctions are discussed, and their consequences on the compact modeling of short-channel effects (SCEs) in MOSFETs are investigated. It is first shown that the previous voltage-doping transform (VDT) potential model does not agree with the simulation results when the impact of lightly doped drain regions or thin spacers are considered. A solution is then proposed to correct the channel potential model using more accurate boundary conditions at the edges of the channel, which consist in calculating an accurate effective built-in potential value at the source and at the drain. The impact of these improved boundary conditions on compact models of SCEs is investigated. It is shown that the previous VDT models of drain-induced barrier lowering and subthreshold swing for all types of fully depleted devices can be very simply corrected to finely agree with the simulations without fitting parameters. These models finally allow to investigate the impact of the doping concentration of the junctions on the device performance.
机译:本文讨论了结边缘的边界条件,并研究了它们对MOSFET中短沟道效应(SCE)的紧凑建模的影响。首先表明,当考虑轻掺杂漏极区或薄隔离层的影响时,先前的电压掺杂变换(VDT)电势模型与仿真结果不一致。然后提出一种解决方案,以在通道边缘使用更准确的边界条件来校正通道电势模型,该条件包括在源极和漏极处计算准确的有效内置电势值。研究了这些改进的边界条件对SCE紧凑模型的影响。结果表明,对于所有类型的完全耗尽的器件,先前的VDT模型引起的势垒降低和亚阈值摆动的VDT模型可以非常简单地进行校正,以与模拟精确地吻合,而无需拟合参数。这些模型最终允许研究结的掺杂浓度对器件性能的影响。

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