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Impact of Channel Hot-Hole Stressing on Gate-Oxide Trap’s Emission

机译:信道热孔胁迫对氧化术陷阱排放的影响

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Fluctuating parametric shifts that arise from the stochastic capture/emission by oxide traps in small gate-area MOSFETs have triggered considerable interest due to their impact on timing-sensitive circuits. To date, studies have only reported the effect of gate voltage stress on oxide traps, while the effect of drain voltage stress is equally important but is seldom studied. This work examines the impact of channel hot-hole (CHH) stress on oxide traps in a nanoscale p-MOSFET. A change in the traps’ emission time constants under operating gate voltage is observed after the CHH stress. Traps which are relatively inactive (capture once and does not emit within the measurement timeframe) may be rendered much more active (exhibit many capture and emission events) after the CHH stress due to a decrease in the emission time constant. On the other hand, traps which are active may become inactive after the CHH stress due to an increase of the emission time constant. Reversion to the pre-CHH-stress behavior is observed after extended rest under unbiased condition. The traps could then undergo similar changes in emission behavior when the CHH stress is reapplied.
机译:由于它们对时序敏感电路的影响,从小型栅极区域MOSFET中的随机捕获/发射产生的波动的参数移位引起了相当大的兴趣。迄今为止,研究仅报告了栅极电压应力对氧化物疏水阀的影响,而漏极电压应力的效果同样重要,但很少研究。这项工作探讨了通道热孔(CHH)应力在纳米级P-MOSFET中氧化阱的影响。在CHH应力之后观察到操作栅极电压下的陷阱发射时间常数的变化。由于发射时间常数的降低,在CHH应力之后,可以在CHH应力之后呈现比较不活跃(捕获一次并且在测量时间帧内不会发射一次)的陷阱可以更加活跃(展示许多捕获和发射事件)。另一方面,由于发射时间常数的增加,在CHH应力之后,所活性的陷阱可能变得无效。在不偏不倚的条件下延长休息后观察到对前CHH胁迫行为的逆转。然后,当CHH应力重新施加时,陷阱可以在发射行为中发生类似的变化。

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