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Physics-Based Device-Circuit Cooptimization Scheme for 7-nm Technology Node SRAM Design and Beyond

机译:7纳米技术节点SRAM设计及超越物理基于设备电路COOptimization方案

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摘要

This article presents a comprehensive assessment on the 6T static random access memory (SRAM) cell with 7-nm FinFET technology by implementing quantum physics-based device-circuit cooptimization. Seven key device design parameters and their multiple impacts on a 6T SRAM cell are systematically evaluated, focusing on materials band engineering, device design, circuit parameters tradeoff, and variation control. The area of SRAM cell under the same Fin quantization scheme remains constant in all evaluations. To the best of our knowledge, the most comprehensive discussion about circuit optimization from multiple device design parameters perspective is presented. Based on our cooptimization scheme, a SRAM cell is effectively designed. For a low-power and robust SRAM cell design, we achieve 56.7% reduction in leakage, 7.9% improvement in hold noise margin (HNM), 8.6% improvement in read noise margin (RNM), and 10.8% improvement in write margin (WM) at the expense of 19.3% increase in delay under design space of gate length (Lg) and spacer thickness (TSPC). For a high-speed SRAM cell design, we recommend focusing on the optimization of architecture and peripheral circuits. This framework not only has the advantages of easy implementation, technology-friendly, and high accuracy, but also suitable for path-finding researches on 5-nm node and beyond.
机译:本文通过实现基于量子物理基础的设备电路CoOptimization,对具有7-NM FinFET技术的6T静态随机存取存储器(SRAM)单元进行全面评估。系统地评估七个关键设备设计参数及其对6T SRAM单元格的多次影响,专注于材料带工程,设备设计,电路参数权衡和变化控制。在相同翅片量化方案下的SRAM电池区域在所有评估中保持恒定。据我们所知,提出了关于多种设备设计参数透视的关于电路优化的最全面的讨论。基于我们的高考方案,设计了SRAM细胞。对于低功耗和强大的SRAM Cell设计,我们降低了56.7%的泄漏,保持噪声保证金(HNM)的提高7.9%,读取噪声裕度(RNM)的提高8.6%,写入边距的提高10.8%(WM )在栅极长度(LG)和间隔厚度(TSPC)的设计空间下延迟增加19.3%。对于高速SRAM Cell设计,我们建议侧重于优化架构和外围电路。该框架不仅具有实现,技术友好,精度高,准确性高的优点,而且适用于5-NM节点及更远的路径查找研究。

著录项

  • 来源
    《IEEE Transactions on Electron Devices》 |2020年第3期|907-914|共8页
  • 作者单位

    Chinese Acad Sci Key Lab Microelect Device & Integrated Technol Inst Microelect Beijing 100029 Peoples R China|Univ Chinese Acad Sci Beijing 100029 Peoples R China;

    Chinese Acad Sci Key Lab Microelect Device & Integrated Technol Inst Microelect Beijing 100029 Peoples R China|Univ Chinese Acad Sci Beijing 100029 Peoples R China;

    Huazhong Univ Sci & Technol Sch Opt & Elect Informat Wuhan 430074 Peoples R China;

    Chinese Acad Sci Key Lab Microelect Device & Integrated Technol Inst Microelect Beijing 100029 Peoples R China|Univ Chinese Acad Sci Beijing 100029 Peoples R China;

    Chinese Acad Sci Key Lab Microelect Device & Integrated Technol Inst Microelect Beijing 100029 Peoples R China|Univ Chinese Acad Sci Beijing 100029 Peoples R China;

    Chinese Acad Sci Key Lab Microelect Device & Integrated Technol Inst Microelect Beijing 100029 Peoples R China|Univ Chinese Acad Sci Beijing 100029 Peoples R China;

    Chinese Acad Sci Key Lab Microelect Device & Integrated Technol Inst Microelect Beijing 100029 Peoples R China|Univ Chinese Acad Sci Beijing 100029 Peoples R China;

    Chinese Acad Sci Key Lab Microelect Device & Integrated Technol Inst Microelect Beijing 100029 Peoples R China|Univ Chinese Acad Sci Beijing 100029 Peoples R China;

    Chinese Acad Sci Key Lab Microelect Device & Integrated Technol Inst Microelect Beijing 100029 Peoples R China|Univ Chinese Acad Sci Beijing 100029 Peoples R China;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    7-nm technology node and beyond; device-circuit cooptimization; FinFET; static random access memory (SRAM);

    机译:7-NM技术节点及更大;设备电路CoOptimization;FinFET;静态随机存取存储器(SRAM);

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