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New device degradation due to 'cold' carriers created by band-to-band tunneling

机译:新的设备性能下降是由于带间隧道技术产生了“冷”载流子

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Device degradation caused by so-called 'cold' carriers due to band-to-band tunneling in a MOS drain region is studied. The cold carriers acquire energy from the electric field in the drain region and surmount the Si-SiO/sub 2/ barrier. In an n-channel device, injected holes cause a decrease in the tunnel current and a negative MOS threshold-voltage shift opposite to that observed in hot-carrier degradation previously reported. A simple analytical model is presented. This model agrees well with the experimental data in both n- and p-channel devices.
机译:研究了由于MOS漏区中的带间隧道效应而引起的所谓“冷”载流子引起的器件性能下降。冷载流子从漏极区域的电场中获取能量,并超过了Si-SiO / sub 2 /势垒。在n沟道器件中,注入的空穴会导致隧道电流减小,并且MOS阈值电压的负移与先前报道的热载流子退化中观察到的相反。提出了一个简单的分析模型。该模型与n通道和p通道设备中的实验数据非常吻合。

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