首页> 外文期刊>IEEE Electron Device Letters >The enhancement of gate-induced-drain-leakage (GIDL) current in short-channel SOI MOSFET and its application in measuring lateral bipolar current gain beta
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The enhancement of gate-induced-drain-leakage (GIDL) current in short-channel SOI MOSFET and its application in measuring lateral bipolar current gain beta

机译:短沟道SOI MOSFET中栅极感应漏电流(GIDL)的增强及其在测量横向双极电流增益beta中的应用

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摘要

An off-state leakage current unique for short-channel SOI MOSFETs is reported. This off-state leakage is the amplification of gate-induced-drain-leakage current by the lateral bipolar transistor in an SOI device due to the floating body. The leakage current can be enhanced by as much as 100 times for 1/4 mu m SOI devices. This can pose severe constraints in future 0.1 mu m SOI device design. A novel technique was developed based on this mechanism to measure the lateral bipolar transistor current gain beta of SOI devices without using a body contact.
机译:据报道,短通道SOI MOSFET具有独特的截止状态泄漏电流。这种关态泄漏是由于浮体而导致的SOI器件中的横向双极型晶体管对栅极感应漏电流的放大。对于1/4μmSOI器件,泄漏电流可以提高100倍之多。这可能对未来的0.1μmSOI器件设计构成严格的限制。基于这种机制开发了一种新颖的技术,无需使用身体接触即可测量SOI器件的横向双极晶体管电流增益β。

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