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Effect of substrate bias on the performance and reliability of the split-gate source-side injected flash memory

机译:衬底偏压对分裂栅源极侧注入闪存的性能和可靠性的影响

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摘要

The effects of the substrate bias on the characteristics of split-gate EEPROM/Flash memory cells have been investigated. It is experimentally demonstrated that applying negative substrate bias (NSB) can improve the programming and erasing speed significantly. The improvements can be attributed that NSB effectively increase the needed electrical fields for fast programming and erasing, respectively. Furthermore, the cycling endurance is improved considerably if NSB is applied for programming and erasing operation both.
机译:已经研究了衬底偏压对分离栅EEPROM /闪存单元的特性的影响。实验证明,施加负衬底偏压(NSB)可以显着提高编程和擦除速度。这些改进可以归因于NSB分别有效地增加了快速编程和擦除所需的电场。此外,如果将NSB用于编程和擦除操作,则可大大提高循环耐久性。

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