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On the correlation between drain-gate breakdown voltage and hot-electron reliability in InP HEMTs

机译:InP HEMT中漏栅击穿电压与热电子可靠性之间的关系

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摘要

By comparing devices with different recess widths, we show that the off-state drain-gate breakdown voltage (BV/sub DG/) may give totally misleading indications on the reliability of lattice-matched InP HEMTs under hot-electron (HE) and impact ionization conditions, from both standpoints of gradual and catastrophic degradation. Since the hot-electron degradation effects observed in our HEMTs are quite common, we believe that our results should be considered as a general caveat whenever indications on HE HEMT robustness are inferred from BV/sub DG/ measurements.
机译:通过比较具有不同凹槽宽度的器件,我们表明,在热电子(HE)和冲击下,截止状态的漏极-栅极击穿电压(BV / sub DG /)可能完全误导晶格匹配的InP HEMT的可靠性。从逐渐退化和灾难性退化的角度来看,电离条件。由于在HEMT中观察到的热电子降解效应非常普遍,因此我们认为,只要从BV / sub DG /测量中推断出HE HEMT的稳健性指标,就应将我们的结果视为一般警告。

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