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Schottky Barrier N-Type Thin Film Transistors With Polycrystalline Silicon Channel and Er-Silicided Metallic Junctions

机译:具有多晶硅通道和硅化金属结的肖特基势垒N型薄膜晶体管

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N-type Schottky barrier thin film transistors (SB-TFTs) with polycrystalline silicon channel and metallic junctions were fabricated by using Er silicidation, and electrical structural properties were compared to conventional TFTs with phosphorous-doped source/drain regions. The performances of SB-TFTs are better than that of the conventional TFTs. A forming gas annealing process leads to a great improvement in the characteristics of both devices. In particular, excellent electrical characteristics were obtained from the forming gas annealed SB-TFTs: the subthreshold swing of 180 mV/dec, the drive current of $hbox{1.47} times hbox{10}^{-5} hbox{A}$, and the on/off current ratio of $ hbox{5} times hbox{10}^{6}$.
机译:利用Er硅化法制备了具有多晶硅沟道和金属结的N型肖特基势垒薄膜晶体管(SB-TFT),并将其电结构性能与具有磷掺杂源/漏区的常规TFT进行了比较。 SB-TFT的性能优于常规TFT。形成气体退火工艺导致两个器件的特性都有很大的改善。特别是,从形成气体退火的SB-TFT中获得了出色的电特性:亚阈值摆幅为180 mV / dec,驱动电流为$ hbox {1.47}乘以hbox {10} ^ {-5} hbox {A} $ ,以及开/关电流比率$ hbox {5}乘以hbox {10} ^ {6} $。

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