首页> 外文期刊>Electron Device Letters, IEEE >A Source-Side Injection Lucky Electron Model for Schottky Barrier Metal–Oxide–Semiconductor Devices
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A Source-Side Injection Lucky Electron Model for Schottky Barrier Metal–Oxide–Semiconductor Devices

机译:肖特基势垒金属-氧化物-半导体器件的源侧注入幸运电子模型

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This letter explores source-side injection in Schottky barrier metal–oxide–semiconductor (MOS) devices. Unlike drain-side injection in conventional MOS devices, a source-side lucky electron model predicts the specific source-side injection in Schottky barrier MOS devices. The source-side electric field is derived from the solutions of 2-D Poisson's equations. The conformal-mapping method is used to estimate the gate electrode contribution to determine the source-side injected probability. 2-D device simulations confirm the agreements between the analytical models and the numerical results. This study provides a physical understanding of enhanced source-side injection in new Schottky barrier nonvolatile memory.
机译:这封信探讨了肖特基势垒金属氧化物半导体(MOS)器件中的源极侧注入。与常规MOS器件中的漏极侧注入不同,源极侧的幸运电子模型可以预测肖特基势垒MOS器件中特定的源极侧注入。源侧电场是从二维泊松方程的解中得出的。共形映射方法用于估计栅极贡献,以确定源极侧注入概率。二维设备模拟证实了分析模型与数值结果之间的一致性。这项研究提供了对新型肖特基势垒非易失性存储器中增强的源极侧注入的物理理解。

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