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A Superjunction Schottky Barrier Diode With Trench Metal–Oxide–Semiconductor Structure

机译:具沟槽金属-氧化物-半导体结构的超结肖特基势垒二极管

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A superjunction Schottky barrier diode with trench metal–oxide–semiconductor (MOS) structure (TM-SJ-SBD) is proposed and studied by 2-D numerical simulations. The device shows the decreasing leakage current, as compared with the common superjunction Schottky barrier diode (SJ-SBD), without considerable degradation of forward characteristics. With optimized parameters, the TM-SJ-SBD attains a breakdown voltage of 178 V, which is similar to that of the SJ-SBD, and a leakage current of $hbox{1.57} times hbox{10}^{-5} hbox{A/cm}^{2}$ at 130-V reverse bias, which is 46.5% smaller than that of the SJ-SBD. In addition, the TM-SJ-SBD achieves softer reverse recovery characteristics, and the reverse recovery peak current is 67.9% smaller than that of the SJ-SBD.
机译:提出了具有沟槽金属-氧化物-半导体(MOS)结构的超结肖特基势垒二极管(TM-SJ-SBD)并通过二维数值模拟进行了研究。与普通的超结肖特基势垒二极管(SJ-SBD)相比,该器件显示出减小的泄漏电流,而正向特性没有明显下降。通过优化的参数,TM-SJ-SBD的击穿电压达到178 V,与SJ-SBD的击穿电压相似,泄漏电流为$ hbox {1.57}乘以hbox {10} ^ {-5} hbox在130V反向偏置下的{A / cm} ^ {2} $,比SJ-SBD小46.5%。此外,TM-SJ-SBD具有更柔和的反向恢复特性,反向恢复峰值电流比SJ-SBD小67.9%。

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