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首页> 外文期刊>Electron Device Letters, IEEE >Improved Channel Mobility in 4H-SiC MOSFETs by Boron Passivation
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Improved Channel Mobility in 4H-SiC MOSFETs by Boron Passivation

机译:通过硼钝化提高4H-SiC MOSFET的沟道迁移率

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摘要

We propose another process for fabricating 4H-SiC metal–oxide–semiconductor field-effect transistors (MOSFETs) with high channel mobility. The B atoms were introduced into a SiO/4H-SiC interface by thermal annealing with a BN planar diffusion source. The interface state density near the conduction band edge of 4H-SiC was effectively reduced by the B diffusion and the fabricated 4H-SiC MOSFETs showed a peak field-effect mobility of 102 /Vs. The obtained high channel mobility cannot be explained by counter doping because B atoms act as acceptors in 4H-SiC. We suggest that the interfacial structural change of SiO may be responsible for the reduced trap density and enhanced channel mobility.
机译:我们提出了另一种制造具有高沟道迁移率的4H-SiC金属-氧化物-半导体场效应晶体管(MOSFET)的方法。通过使用BN平面扩散源进行热退火,将B原子引入SiO / 4H-SiC界面。通过B扩散有效地降低了4H-SiC导带边缘附近的界面态密度,制得的4H-SiC MOSFET的场效应迁移率峰值为102 / Vs。不能通过反掺杂来解释获得的高沟道迁移率,因为B原子充当4H-SiC中的受体。我们建议SiO的界面结构变化可能是导致陷阱密度降低和沟道迁移率提高的原因。

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