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High-Performance Multilevel Resistive Switching Gadolinium Oxide Memristors With Hydrogen Plasma Immersion Ion Implantation Treatment

机译:高性能氢离子注入离子注入处理的多级电阻开关氧化m忆阻器

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Multilevel resistive switching (RS) of gadolinium oxide $({rm Gd}_{x}{rm O}_{y})$ memristors treated by hydrogen plasma immersion ion implantation (PIII) was investigated. Hydrogen ions were implanted at the ${rm Pt}/{rm Gd}_{x}{rm O}_{y}$ interface to modify the oxygen-vacancy distribution, which was examined by the X-ray photoelectron spectroscopy. After the hydrogen PIII treatment, a forming process is needed to operate the ${rm Gd}_{x}{rm O}_{y}$ memristors and the RS mechanism is changed from Schottky emission to space-charge-limited conduction. Superior multilevel RS properties such as data retention for more than $10^{4}~{rm s}$ at 85 $^{circ}{rm C}$, and sequentially cycling test for more than $10^{3}$ times with a resistance ratio of approximately one order of magnitude between each state are realized, making the future high-density flash memory possible.
机译:研究了通过氢等离子体浸没离子注入(PIII)处理的氧化g $({rm Gd} _ {x} {rm O} _ {y})$忆阻器的多级电阻转换(RS)。将氢离子注入到$ {rm Pt} / {rm Gd} _ {x} {rm O} _ {y} $界面处,以修改氧空位分布,这通过X射线光电子能谱进行了检查。在氢PIII处理之后,需要形成过程来操作$ {rm Gd} _ {x} {rm O} _ {y} $忆阻器,并且RS机制从肖特基发射变为空间电荷受限的传导。出色的多级RS特性,例如,在85 $ ^ {circ} {rm C} $时,数据保留超过$ 10 ^ {4}〜{rm s} $,并依次循环测试超过$ 10 ^ {3} $次在每个状态之间实现大约一个数量级的电阻比,使得将来的高密度闪存成为可能。

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