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High-Performance Top-Gate and Self-Aligned In–Ga–Zn-O Thin-Film Transistor Using Coatable Organic Insulators Fabricated at 150 °C

机译:高性能顶栅和自对准In-Ga-Zn-O薄膜晶体管,使用可在150°C制备的可涂覆有机绝缘体

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摘要

We fabricated top-gate and self-aligned indium- gallium-zinc-oxide thin-film transistors (IGZO TFTs) at a maximum process temperature of 150 °C using a coatable organic gate insulator (OGI). By forming a damage and contaminationfree interface between the IGZO channel and OGI, and forming low-resistive source/drain regions by Al reaction method, we achieved good TFT properties, such as field effect mobility of 9.8 cm2/Vs, subthreshold swing of 0.21 V/decade, and hysteresis of 0.3 V, with minimizing a parasitic capacitance. Although the TFT showed an abnormal degradation behavior under positive gate bias stress testing in an ambient air, it was suppressed by forming an additional organic passivation layer.
机译:我们使用可涂覆的有机栅绝缘体(OGI)在最高工艺温度为150°C的条件下制造了顶栅和自对准铟镓锌氧化物薄膜晶体管(IGZO TFT)。通过在IGZO通道和OGI之间形成无损伤且无污染的界面,并通过Al反应方法形成低电阻的源/漏区,我们获得了良好的TFT特性,例如9.8 cm2 / Vs的场效应迁移率,0.21 V的亚阈值摆幅/ decade和0.3 V的磁滞,同时将寄生电容降至最低。尽管TFT在环境空气中的正栅极偏置应力测试下显示出异常的降解行为,但通过形成额外的有机钝化层可以抑制TFT的降解。

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