Wafer-Level Light Emitting Diode (WL-LED) Chip Simplified Package for Very-High Power Solid-State Lighting (SSL) Source

摘要

A simplified packaging process was successfully developed for a wafer-level light emitting diode (WL-LED) chip aiming at very-high power solid-state lighting (SSL) applications. Compared with the traditional chip-on-board (COB) technology, WL-LED chip not only greatly simplifies the packaging process but also enables the lighting source more compact. The fabricated blue WL-LED SSL source with a record-high light output power of 305 W exhibits % wall plug efficiency at an input electrical power of 1026 W.