首页> 外国专利> LIGHT EMITTING DIODE PACKAGE WHICH INCLUDES A LIGHT EMITTING DIODE CHIP CAPABLE OF BEING OPERATED WITH A DOMESTIC AC POWER SOURCE WITHOUT AN AC-DC CONVERTER

LIGHT EMITTING DIODE PACKAGE WHICH INCLUDES A LIGHT EMITTING DIODE CHIP CAPABLE OF BEING OPERATED WITH A DOMESTIC AC POWER SOURCE WITHOUT AN AC-DC CONVERTER

机译:包含能够在没有AC-DC转换器的情况下使用本地交流电源工作的发光二极管芯片的发光二极管封装

摘要

PURPOSE: A light emitting diode package which includes a light emitting diode chip is provided to prevent separation of a heat sink from a package main body by including a heat sink support ring.;CONSTITUTION: A first connection lead(555) connected to a heat sink is arranged on one side of the heat sink. A second connection lead(557) is arranged on the other side of the heat sink by being separated from the heat sink. A package main body(570) fixes the heat sink, the first connection lead, and the second connection lead. The lower surface of the heat sink is exposed from the lower side of the package main body. A part of a heat sink side surface is fixed by being combined with the package main body.;COPYRIGHT KIPO 2012
机译:目的:提供包括发光二极管芯片的发光二极管封装,以通过包括散热片支撑环来防止散热片与封装主体分离。组成:连接到散热器的第一连接引线(555)散热器布置在散热器的一侧。第二连接引线(557)通过与散热器分离而布置在散热器的另一侧。封装主体(570)固定散热器,第一连接引线和第二连接引线。散热器的下表面从封装主体的下侧露出。散热器侧面的一部分通过与封装主体结合而固定。; COPYRIGHT KIPO 2012

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