首页> 外文期刊>IEEE Electron Device Letters >Local Defect Density in Polycrystalline High-k Dielectrics: CAFM-Based Evaluation Methodology and Impact on MOSFET Variability
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Local Defect Density in Polycrystalline High-k Dielectrics: CAFM-Based Evaluation Methodology and Impact on MOSFET Variability

机译:多晶高k电介质中的局部缺陷密度:基于CAFM的评估方法及其对MOSFET可变性的影响

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摘要

A methodology to determine with nanometer resolution the defect density in polycrystalline HfO2 layers has been developed. This methodology is based on experimental data measured with conductive atomic force microscopy and the obtained results have been validated using Kelvin prove force microscopy measurements. The local defect density (ρox) and thickness (tox) of the gate dielectric have been included into a device simulator to evaluate their impact on the IDVG curves of MOSFETs.
机译:已经开发出一种以纳米分辨率确定多晶HfO2层中缺陷密度的方法。该方法基于导电原子力显微镜测量的实验数据,并且使用开尔文证明力显微镜测量方法验证了所获得的结果。栅极电介质的局部缺陷密度(ρox)和厚度(tox)已包含在器件仿真器中,以评估它们对MOSFET IDVG曲线的影响。

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