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A Novel Low VF Super Barrier Rectifier (SBR) With an N-Enhancement Layer

机译:具有N增强层的新型低VF超级势垒整流器(SBR)

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摘要

In this letter, a novel super barrier rectifier with an N-enhancement layer (NEL-SBR) is proposed and experimentally demonstrated. Similar to, yet different from, the anti-JFET implantation technology for planar VDMOS, the NEL design equips this new rectifier with enhanced forward conduction ability. As the experimental results show, the proposed NEL-SBR had an improved performance with regard to a lower forward voltage drop and a larger figure of merit than those of the SBR without NEL. For the new NEL-SBR, only one blanket shallow ion implantation step was added to the manufacturing process of the SBR without NEL. The breakdown voltages of the fabricated SBRs with and without NEL were all greater than 50 V. By removing N+ contact, a reduction in the manufacturing process complexity is obtained, and the potential reliability issues from the parasitic N+/P/N structure for the devices presented earlier will not arise for the proposed new SBRs. Therefore, the proposed devices are promising rectifiers that can be used in power electronic applications.
机译:在这封信中,提出并通过实验证明了一种新型的具有N增强层的超级势垒整流器(NEL-SBR)。与平面VDMOS的抗JFET注入技术相似,但又有所不同,NEL设计为这种新型整流器提供了增强的正向传导能力。如实验结果所示,与没有NEL的SBR相比,所提出的NEL-SBR的正向电压降更低,品质因数更高,因此性能得到了改善。对于新的NEL-SBR,没有NEL的SBR的制造过程仅增加了一个毯式浅离子注入步骤。带有和不带有NEL的已制作SBR的击穿电压均大于50V。通过去除N +接触,可以降低制造工艺的复杂性,并从器件的寄生N + / P / N结构中潜在的可靠性问题提议的新SBR不会出现前面介绍的内容。因此,所提出的器件是可用于电力电子应用的有希望的整流器。

著录项

  • 来源
    《Electron Device Letters, IEEE》 |2017年第2期|244-247|共4页
  • 作者单位

    State Key Laboratory of Power Transmission Equipment and System Security and New Technology, Chongqing University, Chongqing, China;

    Science and Technology on Analog Integrated Circuit Laboratory, Chongqing, China;

    Chongqing Semi-chip Electronics Co., Ltd, Chongqing, China;

    Science and Technology on Analog Integrated Circuit Laboratory, Chongqing, China;

    State Key Laboratory of Power Transmission Equipment and System Security and New Technology, Chongqing University, Chongqing, China;

    State Key Laboratory of Power Transmission Equipment and System Security and New Technology, Chongqing University, Chongqing, China;

    State Key Laboratory of Electronic Thin Film and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, China;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Rectifiers; Logic gates; Current measurement; Fabrication; Substrates; Manufacturing processes; Metals;

    机译:整流器;逻辑门;电流测量;制造;基板;制造工艺;金属;

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