Effects of Joining Conditions on Joint Strength of Cu/Cu Joint Using CuNanoparticle Paste

摘要

High-temperature bonding, or joining, is a key technology for electronic component assembly and other hightemperatureapplications. Recently, focusing on the sintering behavior of nanoparticles, the joining process using ananoparticle paste has been proposed as an alternative to soldering for high-temperature applications. In this study, Cunanoparticle paste was used to join two Cu discs, and the effect of joining conditions on the joint strength of the Cu-to-Cujoint was investigated. Joining using Cu nanoparticle paste was successfully achieved, but the effect of joining conditionssuch as heating temperature and joining atmosphere on joint strength of the Cu-to-Cu joint was significant.