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机译:低温烧结微米纳米Cu复合浆料制备高强度Cu-Cu接头
School of Mechanical Science and Engineering Huazhong University of Science and Technology Wuhan 430074 China School of Aerospace Engineering Huazhong University of Science and Technology Wuhan 430074 China;
School of Mechanical Science and Engineering Huazhong University of Science and Technology Wuhan 430074 China;
School of Mechanical Science and Engineering Huazhong University of Science and Technology Wuhan 430074 China;
School of Mechanical Science and Engineering Huazhong University of Science and Technology Wuhan 430074 China State Key Laboratory of Digital Manufacturing Equipment and Technology Huazhong University of Science and Technology Wuhan 430074 China;
机译:通过在环境条件下通过低温烧结通过低温烧结Cu-Cu接头形成
机译:使用具有低温无压烧结的双峰型Cu纳米粒子糊剂的模具连接接头的优异强度和强化机理
机译:老化气氛对低温迅速烧结Cu纳米粒子糊剂的热稳定性的影响
机译:由微米级镀银薄片和纳米级银颗粒组成的混合浆料的制备以及低温烧结混合浆料接头的表征
机译:用于半导体器件互连的纳米级银浆的低温烧结。
机译:液相烧结氧化铝陶瓷和Ag-Cu-Ti钎焊合金制成的高强度钎焊接头界面的次级相相互作用
机译:- 硝酸铜涂层siC粉末放电等离子烧结制备Cu基siC复合材料