Silicon-Interconnect Fabric for Fine-Pitch (≤10 μm) Heterogeneous Integration

摘要

The apparent saturation of aggressive Moore's law scaling of semiconductor technologies is pushing the boundaries of traditional packaging and integration schemes to accommodate the ever-growing data bandwidth and heterogeneity demands. In this article, we demonstrate the silicon-interconnect fabric (Si-IF) technology as a superior alternative to conventional printed circuit boards (PCBs) to enhance system scaling. The Si-IF is a silicon-based, package-less, fine-pitch, highly scalable, heterogeneous integration platform to assemble and integrate massive wafer-scale systems. In this technology, dielets are closely assembled on the Si-IF at small interdielet spacings (<= 50 mu m) using fine-pitch (<= 10 mu m) die-to-substrate interconnects allowing for tight integration on a system-level package. To achieve these fine-pitch interconnects, a novel assembly technique using solder-less direct metal-metal [copper-copper (Cu-Cu)] thermal compression bonding was developed. Using this process, sub-10-mu m-pitch interconnects with a low specific contact resistance of <= 0.7 Omega.gm(2) and high shear force of 90 N for 4-mm(2) dies were successfully demonstrated. Moreover, these fine-pitch interconnects combined with the small interdie spacing provide a large number of parallel short links (<= 500 mu m) with low loss (<= 2 dB) for interdielet communication that is comparable to on-chip connections. Consequently, simple buffers can transfer data between dies using a Simple Universal Parallel intERface for chips (SuperCHIPS) protocol at low link latency (<20 ps), low energy per bit (<= 0.03 pJ/b), and high data rates (up to 10 Gh/s/link), corresponding to an aggregate data bandwidth of up to 8 Tb/s/mm. The benefits of the SuperCHIPS interface are experimentally demonstrated using functional dielet assembly on the Si-IF to show 4-23x higher data bandwidth, 3-65x lower latency, and 5-40x lower energy per bit compared to existing integration schemes.