Goodbye, motherboard. Bare chiplets bonded to silicon will make computers smaller and more powerful: Hello, silicon-interconnect fabric

Gupta Puneet; Iyer Subramanian S.

首页> 外文期刊>IEEE Spectrum >Goodbye, motherboard. Bare chiplets bonded to silicon will make computers smaller and more powerful: Hello, silicon-interconnect fabric

【24h】

Goodbye, motherboard. Bare chiplets bonded to silicon will make computers smaller and more powerful: Hello, silicon-interconnect fabric

机译：再见，主板。

获取原文

获取原文并翻译 | 示例

获取外文期刊封面封底 >>

开具论文收录证明 >>

文献代查 >>

页面导航

著录项
相似文献
相关主题

著录项

来源
《IEEE Spectrum》 |2019年第10期|28-33|共6页
作者
Gupta Puneet; Iyer Subramanian S.;
展开▼
作者单位

Univ Calif Los Angeles Elect Engn Los Angeles CA 90095 USA;

展开▼
收录信息
原文格式 PDF
正文语种 eng
中图分类
关键词

相似文献

外文文献
中文文献
专利

1. Silicon-Interconnect Fabric for Fine-Pitch (≤10 μm) Heterogeneous Integration [J] . Jangam SivaChandra, Iyer Subramanian S. Components, Packaging and Manufacturing Technology, IEEE Transactions on . 2021,第5期

机译：用于细间距（≤10μm）的硅互连织物异构整合
2. Silicon Photonic Switch Fabrics in Computer Communications Systems [J] . Lee Benjamin G., Dupuis Nicolas, Pepeljugoski Petar, Lightwave Technology, Journal of . 2015,第4期

机译：计算机通信系统中的硅光子交换结构
3. PowerTherm Attach Process for Power Delivery and Heat Extraction in the Silicon-Interconnect Fabric Using Thermocompression Bonding [C] . Pranav Ambhore, Umesha Mogera, Boris Vaisband, IEEE Electronic Components and Technology Conference . 2019

机译：PowerTherm附着工艺，用于通过热压键合在硅互连织物中进行功率传输和散热
4. Heterogeneous Integration on Silicon-Interconnect Fabric Using Fine-Pitch Interconnects (≤10 μm) [D] . Jangam, SivaChandra. 2020

机译：使用细间距互连（≤10μm）的硅 - 互连织物上的异质整合（≤10μm）

Goodbye, motherboard. Bare chiplets bonded to silicon will make computers smaller and more powerful: Hello, silicon-interconnect fabric

著录项

相似文献

相关主题

期刊订阅