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Completion Time Analysis of Wafer Lots in Single-Armed Cluster Tools With Parallel Processing Modules

机译:具有并行处理模块的单臂集群工具中晶圆批次的完成时间分析

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We analyze the completion time of wafer lots in single-armed cluster tools with parallel processing modules (PMs) by considering the lot switching operation. To effectively assign wafer lots and dispatch overhead hoist transports (OHTs) to manufacturing tools, it is crucial to obtain the completion time of wafer lots. However, estimating the completion time is not straightforward, due to the concurrent processing of two consecutive wafer lots during lot switching operation, which often increases wafer sojourn times in PMs. In this paper, we derive closed-form expressions of the completion time of wafer lots in single-armed cluster tools with parallel PMs. We assume that the robot unloads wafers in the order of their loading sequence. We then experimentally show that the formulas derived can be used even when processing time variation exists or another robot task sequence, which is of first-in first-out (FIFO), is assumed.
机译:我们通过考虑批次切换操作来分析具有并行处理模块(PM)的单臂集群工具中晶圆批次的完成时间。为了有效分配晶圆批次并将高架提升机运输(OHT)分配到制造工具,获得晶圆批次的完成时间至关重要。然而,由于完成批次切换操作时要同时处理两个连续的晶圆,因此估计完成时间并不容易,这通常会增加PM中晶圆的停留时间。在本文中,我们推导了具有并行PM的单臂集群工具中晶圆批的完成时间的闭式表达式。我们假设机器人按晶片加载顺序的顺序卸载晶片。然后,我们通过实验证明,即使存在处理时间变化或假定采用先进先出(FIFO)的另一个机器人任务序列,也可以使用导出的公式。

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