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首页> 外文期刊>IEEE transactions on automation science and engineering >A Cyclic Scheduling Approach to Single-Arm Cluster Tools With Multiple Wafer Types and Residency Time Constraints
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A Cyclic Scheduling Approach to Single-Arm Cluster Tools With Multiple Wafer Types and Residency Time Constraints

机译:具有多个晶圆类型和驻留时间约束的单臂群集工具的循环调度方法

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摘要

With the reduction of wafer batch size on account of the diversification and individuation of consumption demands, increasing importance has been attached to the schedulability and controllability of the cluster tools with multiple wafer types being concurrently processed, while the corresponding research is seldom and still open. This paper is devoted to addressing the steady-state scheduling of single-arm cluster tools with multiple wafer types and residency time constraints. Inspired by the definition of wafer flow pattern for the single wafer type, a novel description for the multiple wafer types is introduced. For the sake of efficiency and simplicity, the multiplex backward sequence is proposed. To balance the workload of process steps, a virtual module technology with a two-tiered architecture is implemented. Furthermore, several sufficient and necessary conditions are derived to verify the schedulability of the system. Finally, an efficient algorithm is presented to find the periodic steady-state schedule, and its practicability and availability are validated by the given illustrative examples.Note to Practitioners-Cluster tools are a kind of highly automated, flexible, and integrated equipment applied widely in diversified semiconductor fabrication processes. Due to the strictness of processing constraints and unavailability of in-built buffers, it is challenging to effectively operate cluster tools. For a higher utilization of processing modules, fabs tend to concurrently process several kinds of wafers with dissimilar recipes in a cluster tool. However, the related scheduling and control problems remain open. With residency time constraints, this paper addresses the scheduling problems of single-arm cluster tools with multiple wafer types. By dissecting the mechanism of mixed-processing of multiple wafer types, several formal conditions are obtained to test the schedulability. Based on the multiplex backward sequence, a cyclic scheduling approach to single-arm cluster tools with multiple wafer types is presented. With the proposed method, schedulability conditions can be readily checked and a periodic schedule can be found easily. Thus, it can be applied to solve practical application problems.
机译:随着晶圆需求量的多样化和个性化的需求,晶圆批量的减少,越来越多的人开始关注同时处理多种晶圆类型的集群工具的可调度性和可控性,而相应的研究却很少而且仍在进行中。本文致力于解决具有多种晶圆类型和驻留时间限制的单臂集群工具的稳态调度。受单一晶片类型的晶片流动模式定义的启发,介绍了多种晶片类型的新颖描述。为了效率和简单性,提出了多路复用后向序列。为了平衡流程步骤的工作量,实施了具有两层体系结构的虚拟模块技术。此外,导出了几个充分必要的条件来验证系统的可调度性。最后,提出了一种有效的算法来查找周期性的稳态调度,并通过给出的示例性例子验证了其实用性和可用性。Practitioners-Cluster工具是一种高度自动化,灵活且集成的设备,广泛应用于多样化的半导体制造工艺。由于处理约束的严格性以及内置缓冲区的不可用,有效操作集群工具具有挑战性。为了提高处理模块的利用率,晶圆厂倾向于在群集工具中同时处理具有不同配方的几种晶圆。但是,相关的调度和控制问题仍然存在。由于驻留时间的限制,本文解决了具有多种晶圆类型的单臂集群工具的调度问题。通过剖析多种晶片的混合处理机制,获得了几种形式条件来测试可调度性。基于多重后向序列,提出了一种具有多种晶圆类型的单臂集群工具的循环调度方法。利用所提出的方法,可以容易地检查可调度性条件,并且可以容易地找到周期性的调度。因此,可以应用于解决实际应用中的问题。

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    Xidian Univ Sch Mechanoelect Engn Xian 710071 Shaanxi Peoples R China|Jiangxi Univ Sci & Technol Sch Mech & Elect Engn Ganzhou 341000 Peoples R China;

    Jiangxi Univ Sci & Technol Sch Mech & Elect Engn Ganzhou 341000 Peoples R China;

    Xidian Univ Sch Mechanoelect Engn Xian 710071 Shaanxi Peoples R China|Nanyang Technol Univ Sch Comp Sci & Engn Coll Engn Singapore 639798 Singapore;

    Xidian Univ Sch Mechanoelect Engn Xian 710071 Shaanxi Peoples R China|Univ Salerno Dept Informat Engn Elect Engn & Appl Math I-84084 Fisciano Italy;

    Nanyang Technol Univ Sch Comp Sci & Engn Coll Engn Singapore 639798 Singapore;

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  • 正文语种 eng
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  • 关键词

    Cluster tools; multiple wafer types; scheduling; semiconductor manufacturing; wafer fabrication;

    机译:集群工具;多种晶片类型;排程半导体制造;晶圆制造;

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