Tamura's Solder Paste Attains Micro- Pitch Flip-Chip Bonding

摘要

Tamura Corp. has developed a solder paste, which realizes 130(xm-pitch flip-chip bonding of semiconductor packages, such as chip scale packages (CSPs) for the formation of micro bumps. Towards Finer-Pitch Bonding The company accommodates flip-chip bonding of semiconductors, which have been becoming increasingly finer, through the use of its original technology for micro fabrication of metal powders and a technology to synthesize flux component that removes oxides.