Tamura Corporation has developed a low-silver content, lead-free solder paste that can be used for a wide variety of applications ranging from solder joints of general components to surface mounting in cellular phones. This newly developed solder paste provides the same workability, high solder joint reliability, and wettability as lead-free solder paste (Sn-3.0Ag-0.5Cu) by using newly developed halogen-free active material and reinforced alloy.
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