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A critical study on different hydrogen plasma treatment methods of a-Si: H/c-Si interface for enhanced defect passivation

机译:用于增强缺陷钝化的A-Si:H / C-Si接口不同氢等离子体处理方法的关键研究

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Defect engineering of amorphous-crystalline silicon interface is a critical aspect for high efficiency silicon heterojunction solar cells. In this work, we have done a comparative study of different hydrogen plasma treatment (HPT) methods namely Pre, Post and Intermediate (Inter) HPT using radio frequency plasma-enhanced chemical vapor deposition (rf-PECVD) to understand the passivation mechanism to obtain state of the art passivation. It was observed that Inter and Post HPT can give high minority carrier lifetime on both p and n type wafers and has lesser interface defect states. The analysis from Fourier Transform Infrared Spectroscopy and high resolution Transmission Electron Microscopy shows that these HPT methods results in higher bulk disorder yet atomically sharp and superior interface due to hydrogen diffusion which saturates the interface dangling bonds. While a Pre-HPT results in epitaxial growth leading to poorer performance inspite of lowest dihydrides in the bulk which further highlights the importance of the interface. We have demonstrated Inter and Post HPT of ultrathin (5 nm) a-Si:H films which could give surface recombination velocity as low as 13 cm/s. The degradation due to hydrogen effusion in these HPT a-Si:H films has also been studied.
机译:无定形晶体硅接口的缺陷工程是高效硅杂交太阳能电池的关键方面。在这项工作中,我们已经采用了不同氢等离子体处理(HPT)方法的比较研究,即使用射频等离子体增强的化学气相沉积(RF-PECVD)预先,柱和中间(互联)HPT来理解获得的钝化机制最先进的钝化。观察到,HPT间和后型HPT可以在P和N型晶片上给出高少数群体载体寿命,并且具有较小的界面缺陷状态。来自傅里叶变换红外光谱和高分辨率透射电子显微镜的分析表明,这些HPT方法导致较高的散装障碍,且由于氢气扩散而导致的原子尖锐且优越的界面,达到界面悬挂键。虽然预象限性导致外延生长导致批量中最低二氢酐的性能较差,但这进一步突出了界面的重要性。我们已经证明了超薄(5nm)A-Si:H薄膜的嵌段和后HPT,其可以使表面重组速度低至13cm / s。还研究了这些HPT A-Si:H膜引起的降解。

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