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Step-edge and stacked-heterostructure high-Tc Josephson junctions for voltage-standard arrays

机译:电压标准阵列的阶跃边缘和堆叠异质结构高Tc Josephson结

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We have explored two high-transition-temperature Josephson junction technologies for application in voltage standard arrays: step-edge junctions made with YBa2Cu3O7-δ and Au normal-metal bridges, and stacked series arrays of Josephson junctions in selectively doped, epitaxially grown Bi2Sr2CaCu2O8 heterostructures. For both kinds of junctions, Shapiro steps induced by a microwave bias were characterized as a function of power. We compare the technologies with respect to critical current and normal resistance uniformity, maximum achievable critical current, critical-current normal-resistance product, and operating temperature.
机译:我们探索了两种在电压标准阵列中应用的高转变温度约瑟夫逊结技术:由YBa2Cu3O7-δ和Au正常金属桥构成的阶梯边缘结,以及在选择性掺杂的外延生长的Bi2Sr2CaCu2O8异质结构中的约瑟夫森结的堆叠系列阵列。 。对于两种结,由微波偏置引起的Shapiro阶跃都被表征为功率的函数。我们在临界电流和法向电阻均匀性,最大可达到的临界电流,临界电流法向电阻乘积和工作温度方面比较了这些技术。

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