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Step-edge and stacked-heterostructure high-T/sub c/ Josephson junctions for voltage-standard arrays

机译:电压标准阵列的阶梯状边缘和堆叠异质结构高T / sub c / Josephson结

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摘要

We have explored two high-transition-temperature Josephson junction technologies for application in voltage standard arrays: step-edge junctions made with YBa/sub 2/Cu/sub 3/O/sub 7-/spl delta// and Au normal-metal bridges, and stacked series arrays of Josephson junctions in selectively doped, epitaxially grown Bi/sub 2/Sr/sub 2/CaCu/sub 2/O/sub 8/ heterostructures. For both kinds of junctions, Shapiro steps induced by a microwave bias were characterized as a function of power. We compare the technologies with respect to critical current and normal resistance uniformity, maximum achievable critical current, critical-current normal-resistance product, and operating temperature.
机译:我们探索了两种用于电压标准阵列的高转变温度约瑟夫森结技术:用YBa / sub 2 / Cu / sub 3 / O / sub 7- / spl delta //和Au正常金属制成的阶梯边缘结选择性掺杂,外延生长的Bi / sub 2 / Sr / sub 2 / CaCu / sub 2 / O / sub 8 /异质结构中的约瑟夫森结的电桥和堆叠串联阵列。对于两种结,由微波偏置引起的Shapiro阶跃都被表征为功率的函数。我们在临界电流和法向电阻均匀性,最大可达到的临界电流,临界电流法向电阻乘积和工作温度方面比较了这些技术。

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